Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-10-16
2007-10-16
Datskovskiy, Michael (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S690000, C361S695000, C361S704000, C165S080300, C165S185000, C257S719000
Reexamination Certificate
active
10999269
ABSTRACT:
The present disclosure relates to a thermal management apparatus used to manage temperature of components mounted to a circuit substrate, such as electronic or optical components. The apparatus includes a heat dissipation structure that includes at least one protrusion extending from a surface of the heat dissipation structure. A carrier structure is also included and engages with the heat dissipation structure. The carrier structure includes an aperture that receives the at least one protrusion. Additionally, the apparatus includes at least one biasing structure that is configured to allow movement of the heat dissipation structure relative to the carrier structure and provides a biasing force tending to move the heat dissipation structure and carrier structure together.
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Photo of ATI graphics card with heat synch (top and bottom view).
Lakhani Salim
Lau Ross
Loro Jim E.
Osqueizadeh Nima
Refai-Ahmed Gamal
ATI Technologies Inc.
Datskovskiy Michael
Vedder Price Kaufman & Kammholz P.C.
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