Thermal managed interconnect system for a circuit board

Details Thermal managed interconnect system for a circuit board Thermal managed interconnect system for a circuit board

2007-07-31

2007-07-31

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S707000, C361S719000, C257S706000, C257S707000, C257S712000, C165S080300

Reexamination Certificate

active

10925091

ABSTRACT:
A thermal management system for an IC device mounted on a circuit board is provided. The system includes a socket housing and an array of power contacts disposed within the housing. The power contacts deliver power to an underside of the IC device and generate heat at the underside of the IC device. A heat conducting interface conveys heat from the underside of the IC device to a heat sink positioned above the IC device.

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