Thermal intermediate apparatus, systems, and methods

Details Thermal intermediate apparatus, systems, and methods Thermal intermediate apparatus, systems, and methods

2003-12-30

2008-11-25

Gurley, Lynne (Department: 2811)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S121000, C438S107000, C438S099000, C438S118000, C257S712000, C257S713000, C257S717000, C257S706000, C257S720000, C257SE51040, C257SE21505

Reexamination Certificate

active

07456052

ABSTRACT:
Apparatus and system, as well as fabrication methods therefor, may include a thermal intermediate structure comprised of a plurality of carbon nanotubes some of which have organic moieties attached thereto to tether the nanotubes to at least one of a die and a heat sink. The organic moieties include thiol linkers and amide linkers.

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