Thermal interface with adhesive

Details Thermal interface with adhesive Thermal interface with adhesive

1998-11-04

1999-06-15

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361683, 361704, 361705, 257713, 257692, 428343, 165 803, 156346, H05K 720

Patent

active

059128054

ABSTRACT:
A thermal interface for facilitating heat transfer from an electronic component to a heat sink. According to a preferred embodiment, the thermal interface comprises first and second generally planar substrates that are compressively bonded to one another. The first substrate has outer periphery that defines a first continuous peripheral edge. The second substrate has an outer periphery that defines a second continuous peripheral edge with at least a portion thereof extending beyond the first peripheral edge of the first substrate. An adhesive is deposited upon the portion of the second substrate extending beyond the peripheral edge of the first substrate, and preferably beyond the interface surface between the electronic component and the heat sink such that the thermal interface may be adhesively secured into position without forming an additional layer therebetween. Layers of conformable heat-conducting material are formed upon the outwardly-facing opposed sides of the bonded substrates to enhance the heat transfer from the electronic component to the heat sink.

REFERENCES:
patent: 4482912 (1984-11-01), Chiba et al.
patent: 4810563 (1989-03-01), DeCree et al.
patent: 4842911 (1989-06-01), Fick
Power Devices, Inc.; "Kapton MT Substrate Coated with High Performance Thermal Compound in Easy-to-Use Form"; 1996; 2 pages; Laguna Hills.
Chomerics; "ThermFlow T705 and T710 Low Thermal Resistance Interface Pads"; 1997; 2 pages.
Chomerics; "ThermFlow T413 and T414 Low Thermally Conductive Adhesive Tapes"; 1994; 3 pages.
Chomerics; "ThermFlow T404 and T405 Low Thermally Conductive Adhesive Tapes"; 1993; 4 pages.
The Bernquist Company; "Sil-Pad Design Guide"; 1993, 22 pages.

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