Thermal interface wafer and method of making and using the same

Details Thermal interface wafer and method of making and using the same Thermal interface wafer and method of making and using the same

2006-02-28

2006-02-28

Flanigan, Allen J. (Department: 3753)

Heat exchange

Heat transmitter

C361S705000

Reexamination Certificate

active

07004244

ABSTRACT:
A thermal interface wafer for facilitating heat transfer from an electronic component to a heat sink. The wafer is formed from at least one elongate, vertically-oriented strip of thermally conductive material having a layer of conformable, heat-conducting material formed thereon. Preferably, the substrate comprises a metal foil, such as aluminum or some other thermally-conductive metal, that is formed as a flat, spiral-like coil. Such strip may further be configured to have a serpentine configuration, or may alternatively be formed from a multiplicity of strips. The present invention further provides for methods of transferring heat from an electronic component to a heat sink, as well as methods for fabricating the thermal interface wafers of the present invention.

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