Thermal interface structure for placement between a...

Details Thermal interface structure for placement between a... Thermal interface structure for placement between a...

2005-09-06

2005-09-06

Zimmerman, John J. (Department: 1775)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S709000, C428S642000, C428S675000, C428S670000, C257S718000, C174S252000

Reexamination Certificate

active

06940721

ABSTRACT:
A multi-layer thermal interface structure for placement between a microelectronic component package and a heat sink so that the structure has a total thermal resistance of no greater than about 0.03° C.-in2/W. The structure comprises a plurality of superimposed metallic layers including a core layer of a solid metal or metal alloy of high thermal conductivity preferably composed of aluminum or copper, a second layer having phase change properties and a third layer of nickel separating the solid metal layer from the layer having phase change properties.

REFERENCES:
patent: 5388755 (1995-02-01), Baxter
patent: 5428889 (1995-07-01), Mita et al.
patent: 5510650 (1996-04-01), Erskine, Jr.
patent: 5616424 (1997-04-01), Carey et al.
patent: 6183886 (2001-02-01), Chen et al.
patent: 6372997 (2002-04-01), Hill et al.
patent: 6390353 (2002-05-01), Lichtenberger
patent: 6600229 (2003-07-01), Mukherjee et al.
patent: 6617517 (2003-09-01), Hill et al.
patent: 6706561 (2004-03-01), Abbott
patent: 6761928 (2004-07-01), Hill et al.
patent: 2002/0175403 (2002-11-01), Sreeram et al.
patent: 2003/0007329 (2003-01-01), Hill
patent: 60-100456 (1985-06-01), None

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