Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2009-03-18
2011-10-11
Luu, Chuong A. (Department: 2892)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S121000, C438S106000, C438S125000
Reexamination Certificate
active
08034662
ABSTRACT:
Various semiconductor chip thermal interface material methods and apparatus are disclosed. In one aspect, a method of establishing thermal contact between a first semiconductor chip and a heat spreader is provided. The method includes placing a thermal interface material layer containing a support structure on the first semiconductor chip. The heat spreader is positioned proximate the thermal interface material layer. The thermal interface material layer is reflowed to establish thermal contact with both the first semiconductor chip and the heat spreader.
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Black Bryan
Refai-Ahmed Gamal
Touzelbaev Maxat
Yang Yizhang
Advanced Micro Devices , Inc.
Honeycutt Timothy M.
Luu Chuong A.
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