Thermal interface material with low melting alloy

Details Thermal interface material with low melting alloy Thermal interface material with low melting alloy

2006-12-12

2006-12-12

Verbitsky, Gail (Department: 2859)

Thermal measuring and testing

Determination of inherent thermal property

Thermal conductivity

C374S152000, C361S679090, C428S3550RA

Reexamination Certificate

active

07147367

ABSTRACT:
A thermal interface composition undergoes a viscoelastic change at microprocessor operating temperatures to transfer heat generated by a heat source, such as a microprocessor to a heat sink. The composition includes a low melting alloy dispersed in a matrix. The matrix comprises a viscoelastic composition which softens at about the operating temperature of the heat source. The viscoelastic composition may include a thermoplastic elastomer, a compatible hydrocarbon oil, and a tackifying resin. In use, the thermal interface composition flows under pressure between the heat source and the heat sink to make thermal contact between the two. When the heat source is operated and reaches operating temperature, the viscoelastic composition softens and the low melting alloy melts at around the operating temperature to form a highly thermally conductive, generally homogeneous mixture which readily transfers heat to the heat sink.

REFERENCES:
patent: 4092697 (1978-05-01), Spaight
patent: 4147669 (1979-04-01), Shaheen et al.
patent: 4299715 (1981-11-01), Whitfield et al.
patent: 4427446 (1984-01-01), Miura et al.
patent: 4487856 (1984-12-01), Anderson et al.
patent: 4551490 (1985-11-01), Doyle et al.
patent: 4588762 (1986-05-01), Mruk et al.
patent: 4607277 (1986-08-01), Hassan et al.
patent: 4685987 (1987-08-01), Fick
patent: 4689250 (1987-08-01), Quella et al.
patent: 4729060 (1988-03-01), Yamamoto et al.
patent: 4744850 (1988-05-01), Imano et al.
patent: 4869954 (1989-09-01), Squitieri
patent: 4879632 (1989-11-01), Yamamoto et al.
patent: 4888247 (1989-12-01), Zweben et al.
patent: 4915167 (1990-04-01), Altoz
patent: 5062896 (1991-11-01), Huang et al.
patent: 5170930 (1992-12-01), Dolbear et al.
patent: 5194480 (1993-03-01), Block et al.
patent: 5290624 (1994-03-01), Bujard
patent: 5302344 (1994-04-01), Perlman
patent: 5325265 (1994-06-01), Turlik et al.
patent: 5328087 (1994-07-01), Nelson et al.
patent: 5445308 (1995-08-01), Nelson et al.
patent: 5454473 (1995-10-01), Hennessey
patent: 5459352 (1995-10-01), Layton et al.
patent: 5510174 (1996-04-01), Litman
patent: 5548027 (1996-08-01), Heucher et al.
patent: 5569559 (1996-10-01), Fauvarque
patent: 5591034 (1997-01-01), Ameen et al.
patent: 5612153 (1997-03-01), Moulton et al.
patent: 5679457 (1997-10-01), Bergerson
patent: 5770318 (1998-06-01), Friedman
patent: 5783862 (1998-07-01), Deeney
patent: 5869412 (1999-02-01), Yenni et al.
patent: 5904796 (1999-05-01), Freuler et al.
patent: 5950066 (1999-09-01), Hanson et al.
patent: 5965829 (1999-10-01), Haynes et al.
patent: 6021844 (2000-02-01), Batchelder
patent: 6048919 (2000-04-01), McCullough
patent: 6054198 (2000-04-01), Bunyan et al.
patent: 6096414 (2000-08-01), Young
patent: 6162858 (2000-12-01), Auguste et al.
patent: 6175495 (2001-01-01), Batchelder
patent: 6197859 (2001-03-01), Green et al.
patent: 6202298 (2001-03-01), Smith
patent: 6238596 (2001-05-01), Nguyen et al.
patent: 6281573 (2001-08-01), Atwood et al.
patent: 6287894 (2001-09-01), Sawin
patent: 6291568 (2001-09-01), Lussey
patent: 6339120 (2002-01-01), Misra et al.
patent: 6391442 (2002-05-01), Duvall et al.
patent: 6437038 (2002-08-01), Chen
patent: 6458886 (2002-10-01), Nielsen et al.
patent: 6491426 (2002-12-01), Schonath et al.
patent: 6562452 (2003-05-01), Ferri
patent: 6597575 (2003-07-01), Matayabas et al.
patent: 6620515 (2003-09-01), Feng et al.
patent: 6624224 (2003-09-01), Misra
patent: 6630531 (2003-10-01), Khandpur et al.
patent: 6649012 (2003-11-01), Masayuki et al.
patent: 6651732 (2003-11-01), Sagal
patent: 6663964 (2003-12-01), Mita et al.
patent: 6665186 (2003-12-01), Calmidi et al.
patent: 6791839 (2004-09-01), Bhagwagar
patent: 6797758 (2004-09-01), Misra et al.
patent: 6849953 (2005-02-01), Smith
patent: 2001/0038093 (2001-11-01), Nguyen
patent: 2002/0007014 (2002-01-01), Hyde et al.
patent: 2002/0027910 (2002-03-01), Misra et al.
patent: 2002/0132925 (2002-09-01), Cernohous et al.
patent: 2002/0193724 (2002-12-01), Stebbings et al.
patent: 2003/0027910 (2003-02-01), Misra et al.
patent: 2003/0049154 (2003-03-01), Xu et al.
patent: 2003/0075312 (2003-04-01), Panck
patent: 2003/0203188 (2003-10-01), Bunyan
patent: 2003/0234074 (2003-12-01), Bhagwagar
patent: 2005/0073816 (2005-04-01), Hill et al.
patent: 0 813 244 (1997-12-01), None
patent: 1 067 164 (2001-01-01), None
patent: 1143511 (2001-03-01), None
patent: 1 291 913 (2003-03-01), None
patent: WO 97/41599 (1997-11-01), None
patent: WO 99/19909 (1999-04-01), None

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