Thermal interface material and method for making the same

Details Thermal interface material and method for making the same Thermal interface material and method for making the same

2007-11-06

2007-11-06

McNeil, Jennifer (Department: 1775)

Stock material or miscellaneous articles

Self-sustaining carbon mass or layer with impregnant or...

C977S742000

Reexamination Certificate

active

11321141

ABSTRACT:
A thermal interface material includes a matrix and carbon nanotubes. The matrix includes a first surface and an opposite second surface. The carbon nanotubes are embedded in the matrix uniformly. The carbon nanotubes extend from the first surface to the second surface, and each carbon nanotube has two opposite ends. At least one of the two opposite ends of the carbon nanotubes are exposed out of one of the first and second surfaces of the matrix. The exposed ends of the carbon nanotubes are elastically bent/embedded in a phase change layer formed thereon.

REFERENCES:
patent: 6350488 (2002-02-01), Lee et al.
patent: 6407922 (2002-06-01), Eckblad et al.
patent: 2004/0009353 (2004-01-01), Knowles et al.
patent: 2005/0061496 (2005-03-01), Matabayas Jr.
patent: 2005/0255304 (2005-11-01), Brink
Berber, Savas et al., “Unusually High Thermal Conductivity of Carbon Nanotubes,”Physical Review Letters, vol. 84, No. 20, pp. 4613-4616 (2000).
Fan, Shoushan et al., “Self-Oriented Regular Arrays of Carbon Nanotubes and Their Field Emission Properties,”Science, vol. 283, pp. 512-514 (1999).
Liu, Liang et al., “Isotope Labeling of Carbon Nanotubes and Formation of12C-13C Nanotube Junctions,”J. Am. Chem. Soc., vol. 123, pp. 11502-11503 (2001).

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