Thermal interface material

Details Thermal interface material Thermal interface material

2005-09-20

2005-09-20

Vortman, Anatoly (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S705000, C361S718000, C361S719000, C257S706000, C257S707000, C257S717000

Reexamination Certificate

active

06947285

ABSTRACT:
A thermal interface material (40) includes a polymer matrix and a number of carbon nanocapsules incorporated in the polymer matrix. The thermal interface material is sandwiched between a heat source (30) having a high density and a heat sink (50). The thermal interface material can provide a maximum surface contact area and can increase thermal conductivity between the heat source and the heat sink.

REFERENCES:
patent: 5077637 (1991-12-01), Martorana et al.
patent: 5316080 (1994-05-01), Banks et al.
patent: 5344676 (1994-09-01), Kim et al.
patent: 5390734 (1995-02-01), Voorhes et al.
patent: 5566752 (1996-10-01), Arnold et al.
patent: 5641466 (1997-06-01), Ebbesen et al.
patent: 5698175 (1997-12-01), Hiura et al.
patent: 5742471 (1998-04-01), Barbee et al.
patent: 5753088 (1998-05-01), Olk
patent: 5780101 (1998-07-01), Nolan et al.
patent: 5898569 (1999-04-01), Bhatia
patent: 5965267 (1999-10-01), Nolan et al.
patent: 6052280 (2000-04-01), Dilley et al.
patent: 6060166 (2000-05-01), Hoover et al.
patent: 6131651 (2000-10-01), Richey, III
patent: 6278231 (2001-08-01), Iwasaki et al.
patent: 6407922 (2002-06-01), Eckblad et al.
patent: 6473351 (2002-10-01), Tomanek et al.
patent: 6542370 (2003-04-01), Wang et al.
patent: 2003/0111333 (2003-06-01), Montgomery et al.
patent: 2004/0005736 (2004-01-01), Searls et al.
patent: 2004/0097635 (2004-05-01), Fan et al.

Affiliated with

Also associated with

Rating

Thermal interface material does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermal interface material, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal interface material will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3383294