Thermal interface material

Details Thermal interface material Thermal interface material

2008-06-03

2008-06-03

Green, Anthony J. (Department: 1755)

Compositions

Heat-exchange, low-freezing or pour point, or high boiling...

Organic components

C165S010000, C165S104190, C165S104330, C165S185000, C252S070000, C252S071000, C257S720000, C257SE23080, C257SE23087, C361S699000, C361S704000, C361S709000, C508S150000, C508S154000, C508S165000, C508S172000

Reexamination Certificate

active

07381346

ABSTRACT:
A thermal interface material is for being applied to the contact surfaces to eliminate the air interstices between the heat dissipating apparatus and the electronic component in order to improve heat dissipation of the electronic component. The thermal interface material includes pentaerythritol oleate as base oil and fillers filled in the pentaerythritol oleate for improving the heat conductivity of the thermal interface material. The pentaerythritol oleate is used for holding the fillers therein and filling the air interstices to achieve an intimate contact between the heat dissipating apparatus and the electronic component. The fillers include aluminum powders, zinc oxide powders and zinc oxide nano-particles.

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