Thermal interface for a printed wiring board

Details Thermal interface for a printed wiring board Thermal interface for a printed wiring board

1988-02-12

1989-11-21

Nimmo, Morris H.

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

29843, 29846, 361386, 361414, H05K 100

Patent

active

048824542

ABSTRACT:
A printed wiring board is comprised of a combination of layers providing a good thermal match with surface mount components. The board consists of a core surrounded by multiple layers of dielectric and conductive materials optimized for their thermal expansion qualities. The core is also used as a heat sink for drawing excess heat from the components. An integral thermal interface region is used to dissipate the heat from the core.

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patent: 4736521 (1988-04-01), Dohya
Teschler, Leland; New Circuit Boards Bent Heat and Vibration; Machine Design; vol. 51, No. 2; Jan. 25, 1979; pp. 105-109.
Sacher, E. et al; Printed-Circuit Boards With Low Coefficients of Expansion; IBM Technical Disclosure Bulletin; vol. 32, No. 2; Jul. 1978, p. 500.

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