Thermal interface for a heat sink and a plurality of integrated

Details Thermal interface for a heat sink and a plurality of integrated Thermal interface for a heat sink and a plurality of integrated

1995-08-30

1996-12-24

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257713, 361719, H05K 720

Patent

active

055878822

ABSTRACT:
A referencing scheme provides a thermal interface between a heat sink and chips within a MultiChip Module (MCM). The referencing scheme comprises a heat sink with a support ring that penetrates a trough formed within a substrate of the MCM. A thermal transfer medium positioned between the heat sink and the chips forms a thermal interface having a low thermal resistance. This cools the chips and ensures reliable operation of the MCM. The trough is filled with a curable adhesive, securing the heat sink to the substrate of the MCM.

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Backside Cooling Of Flip Chip Devices In Multichip Modules; Robert Darveaux and Iwona Turlik; ICMCM Proceedings '92; pp. 230-241.
Backside Cooling Solution For High Power Flip Chip Multi-chip Modules; Chandrakant D. Patel; 44th IEEE ECTC Proceedings, May 1994; pp. 442-449.

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