Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-05-06
2008-05-06
Gandhi, Jayprakash (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S707000, C361S709000, C257S712000, C257S713000, C257S720000, C165S185000
Reexamination Certificate
active
07369411
ABSTRACT:
A thermal interface assembly and method for forming a thermal interface between a microelectronic component package and a heat sink having a total thermal resistance of no greater than about 0.03° C.-in2/W comprising interposing a thermal interface assembly between an microelectronic component package and heat sink with the thermal interface assembly comprising a thermal interface material having phase change properties and a sealing member selected from the group consisting of an o-ring and/or shim in an arrangement such that the thermal interface material is shielded from the atmosphere when the microelectronic component package is operational.
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English Translation of Yabe, JP 60-100456, Japanese Publication, Jun. 1985.
Hill Richard
Strader Jason L.
Anderson Kill & Olick PC
Gandhi Jayprakash
Hoffberg Robert J.
Thermagon Inc.
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