Thermal interface apparatus, systems, and methods

Details Thermal interface apparatus, systems, and methods Thermal interface apparatus, systems, and methods

2007-01-16

2007-01-16

Thompson, Gregoty D. (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C029S825000, C165S080200, C165S185000, C257S707000, C257S713000

Reexamination Certificate

active

10404223

ABSTRACT:
An apparatus and system, as well as fabrication methods therefor, may include a die having a surface and a primary material comprising tin, pure tin, or substantially pure tin coupled to the surface. A heat dissipating element may be coupled to the primary material.

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