Thermal interface adapter plate conversion kit and method

Details Thermal interface adapter plate conversion kit and method Thermal interface adapter plate conversion kit and method

2007-04-03

2007-04-03

Dinh, Tuan (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S719000, C361S718000, C361S792000

Reexamination Certificate

active

10428974

ABSTRACT:
A method of selectively assembling a printed circuit board (PCB) module intended for attachment to another structure, such as another larger PCB. A plurality of different mounting hardware for a PCB are provided for enabling the selective enhancement of the thermal characteristics of the module. One embodiment provides a conversion kit comprising a PCB having a circuit mounted thereon, lead frames, a baseplate, and open frame and baseplate mounting hardware that, when selectively attached to the PCB, result in an open frame or a baseplate module. The manufacturer of power conversion or other modules can thus manufacture and pretest the board's electronics before assembly into either an open frame or baseplate module, while also providing a conversion kit that includes inexpensive mounting hardware to enable a user to select between assembling a module as either an open frame or a baseplate module.

REFERENCES:
patent: 5835350 (1998-11-01), Stevens
patent: 5933343 (1999-08-01), Lu et al.
patent: 5973923 (1999-10-01), Jitaru
patent: 6317324 (2001-11-01), Chen et al.
patent: 6459586 (2002-10-01), Miller et al.
patent: D465199 (2002-11-01), Tomioka
patent: 6578260 (2003-06-01), Dixon et al.
patent: 6643135 (2003-11-01), Tomioka

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