Thermal interconnection for capacitor systems

Details Thermal interconnection for capacitor systems Thermal interconnection for capacitor systems

2007-04-10

2007-04-10

Ha, Nguyen T. (Department: 2831)

Electricity: electrical systems and devices

Electrolytic systems or devices

Double layer electrolytic capacitor

C361S504000, C361S508000, C361S509000, C361S512000, C361S523000

Reexamination Certificate

active

10960166

ABSTRACT:
Thermal protection is provided in systems utilizing high-current double-layer capacitors. For example, in one implementation, an interconnection coupled to at least one double-layer capacitor that carries capacitor current to or from the at least one double-layer capacitor is functionally coupled to the at least one double-layer capacitor to reduce a temperature of the capacitor is provided.

REFERENCES:
patent: 5214564 (1993-05-01), Metzler et al.
patent: 6222715 (2001-04-01), Gruhn
patent: 6259595 (2001-07-01), Hebel et al.
patent: 6262360 (2001-07-01), Michel
patent: 6323750 (2001-11-01), Lampi
patent: 6327137 (2001-12-01), Yamamoto et al.
patent: 6424514 (2002-07-01), Boy
patent: 6708757 (2004-03-01), Hebel
patent: 6710996 (2004-03-01), Bobert

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