Thermal interconnection

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

Patent

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Details

361415, 267158, 165185, H05K 720

Patent

active

043227767

ABSTRACT:
Spring 52 mounts on cold plate 12 to urge thermal conductive layers 82 against flange 20 on cold plate 12. Spring has a plurality of pressure flanges, one corresponding to each cold plate flange so that a unitary spring structure can be quickly assembled on the cold plate.
Thermal interconnection is expected to be used on all standard and improved standard electronic modules. It is being designed into ANSQS-53.

REFERENCES:
patent: 4096547 (1978-06-01), Calabro
patent: 4214292 (1980-07-01), Johnson

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