Thermal insulative device and method

Details Thermal insulative device and method Thermal insulative device and method

2008-05-27

2008-05-27

Pascua, Jes F. (Department: 3782)

Flexible bags

Wall details

Multi-layer or ply

C150S154000, C150S901000, C229S087180

Reexamination Certificate

active

07377692

ABSTRACT:
A thermally insulative device and an associated method of using the device for use in temporarily enshrouding a box are disclosed. The device includes the interconnected elements of a one-piece composite jacket, a plurality of primary coupling strips, a plurality of complementary coupling strips, a plurality of straps, and a buckle. The jacket includes a plurality of panels integrally formed together with a plurality of flaps. The method includes the steps of buckling, carrying, contacting, disconnecting, folding, getting, laying, lifting, lowering, obtaining, placing, tying, unbuckling, unwrapping, and wrapping.

REFERENCES:
patent: 664835 (1901-01-01), Czarniecki
patent: 1971395 (1934-08-01), Danner
patent: 2087966 (1937-07-01), Clark
patent: 3262283 (1966-07-01), Taylor
patent: 4489815 (1984-12-01), Martinez et al.
patent: 4509645 (1985-04-01), Hotta
patent: D287921 (1987-01-01), Skamser
patent: 4679242 (1987-07-01), Brockhaus
patent: 4984906 (1991-01-01), Little
patent: 5477965 (1995-12-01), Herbeck
patent: 5582028 (1996-12-01), Rilling et al.
patent: 5590781 (1997-01-01), Shackelford et al.
patent: 5857778 (1999-01-01), Ells
patent: 5904230 (1999-05-01), Peterson
patent: 6027249 (2000-02-01), Bielinski
patent: 6048099 (2000-04-01), Muffett et al.
patent: 6074093 (2000-06-01), Anderson
patent: 6164526 (2000-12-01), Dalvey

Affiliated with

Also associated with

Rating

Thermal insulative device and method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermal insulative device and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal insulative device and method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2808949