Compositions: ceramic – Ceramic compositions – Pore-forming
Patent
1986-09-26
1989-01-31
Dixon, Jr., William R.
Compositions: ceramic
Ceramic compositions
Pore-forming
501 39, 106 75, C04B 3800, C03C 1100
Patent
active
048015636
ABSTRACT:
A thermal insulating material of an expanded, shell-less silica-hydrate has a small bubble structure to enhance the thermal insulating characteristics of the material. Also described is a process for the production of the expanded, shell-less silica-hydrate through selective heating of the silica-hydrate in a moist environment.
REFERENCES:
patent: 1142829 (1915-06-01), Maywald
patent: 2255236 (1941-09-01), Willis
patent: 2691248 (1954-10-01), Ford
patent: 2890126 (1959-06-01), Ford
patent: 3151966 (1964-10-01), Slayter
patent: 3261894 (1966-07-01), Seidl
patent: 3268350 (1966-08-01), Grebe et al.
patent: 3321414 (1967-05-01), Vieli
patent: 3325341 (1967-06-01), Shannon
patent: 3365315 (1968-01-01), Beck et al.
patent: 3466221 (1969-09-01), Sams et al.
patent: 3532480 (1970-10-01), D'Eustachio
patent: 3743601 (1973-07-01), Rao
patent: 3756839 (1973-09-01), Rao
patent: 3844804 (1974-10-01), Horai
patent: 3870496 (1975-03-01), Cutler
patent: 3974315 (1976-08-01), Murata
patent: 4059425 (1977-11-01), Brydges, III et al.
patent: 4080187 (1978-03-01), Parnell
patent: 4584281 (1986-04-01), Foley
Glass Technology Developments Since 1978--Chemical Technology Review No. 184--J. I. Duffy, pp. 98, 99.
"Silicate Science" Wilhelm Eitel (1976), vol. VII--pp. 308-311 and Vol. VIII--pp. 19, 138-139 and 145, 146
Dixon Jr. William R.
Green Anthony J.
Hoffman John F.
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