Stock material or miscellaneous articles – Layer or component removable to expose adhesive – Halogen containing compound
Patent
1980-05-20
1982-11-02
Thibodeau, Paul J.
Stock material or miscellaneous articles
Layer or component removable to expose adhesive
Halogen containing compound
428141, 428143, 428285, 428291, 4283044, 4283115, 428332, 428920, 428236, 428251, B32B 1110, B32B 1102
Patent
active
043573770
ABSTRACT:
A new thermal insulating and bituminous waterproofing board suitable for use in the combined application process of thermal insulation and built-up roofing or waterproofing, as well as the application process thereof are provided. This thermal insulating and bituminous waterproofing board contains: (i) a modified bitumen layer containing, as a principal constituent, a mixture of bitumen and at least one inorganic filler, which layer is formed in the form of a thick board; (ii) a flat sheet laminated on each surface of the modified bitumen layer, said flat sheet consisting of a fibrous sheet, and; (iii) a thermal insulating material layer bonded, via the flat sheets, to one surface of the modified bitumen layer. This thermal insulating and bituminous waterproofing board can be easily and reliably applied onto a substrate without any complex procedures and, also, without causing any damage to the thermal insulating material.
REFERENCES:
patent: 3466222 (1969-09-01), Curtis
patent: 3672951 (1972-06-01), Moore et al.
patent: 3813280 (1974-05-01), Olszyk et al.
patent: 4039706 (1977-08-01), Tajima et al.
Tajima Roofing Co., Ltd.
Thibodeau Paul J.
LandOfFree
Thermal insulating and bituminous waterproofing board and applic does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thermal insulating and bituminous waterproofing board and applic, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal insulating and bituminous waterproofing board and applic will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-624277