Thermal inkjet printhead orifice plate and method of manufacture

Details Thermal inkjet printhead orifice plate and method of manufacture Thermal inkjet printhead orifice plate and method of manufacture

1991-04-16

1992-12-01

Tufariello, T. M.

Electrolysis: processes, compositions used therein, and methods

Electroforming or composition therefor

Perforated or foraminous article

C25D 108

Patent

active

051677768

ABSTRACT:
A new and improved orifice or nozzle plate for an inkjet printhead and method of manufacture wherein the orifice or nozzle plate thickness has been increased significantly to a value on the order of 75 micrometers or greater while simultaneously maintaining the integrity of the convergent contour of the multiple orifice openings formed therein. In a first embodiment of this invention, metal layer stacking through the use of successive electroforming processes is used to achieve a desired orifice plate structure, architecture and convergent orifice geometry. In a second embodiment of this invention, anisotropic electroplating on a metal surface and over the edges of an inorganic dielectric mask is used to produce this orifice plate of increased orifice bore thickness and convergent orifice bore geometry. In yet a third embodiment of the invention, a selected metal is plated upon a permanent insulating mandrel having a metal pattern thereon to form convergent orifice openings in the plated metal. Openings are then formed in the insulating layer which are aligned with electroplated convergent openings in the metal layer to thereby form a composite metal-insulator orifice plate of increased thickness and overall convergent orifice bore geometry.

REFERENCES:
patent: 4374707 (1983-02-01), Pollack

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