Thermal ink jet printhead assembly employing beam lead interconn

Details Thermal ink jet printhead assembly employing beam lead interconn Thermal ink jet printhead assembly employing beam lead interconn

1987-10-26

1989-05-02

Hartary, Joseph W.

Recorders

Markers and/or driving means therefor

With ink supply to marker

346139R, G01D 1516

Patent

active

048272949

ABSTRACT:
This application discloses a new and improved thermal ink jet printhead and method of manufacture wherein a tape automated bond (TAB) flexible circuit is sequentially thermosonically bonded in a one-by-one wire bonding process to aligned conductive traces on a thin film resistor substrate. These traces provide electrical current paths for a corresponding plurality of heater resistors on the substrate, and these resistors function to heat a corresponding plurality of ink reservoirs in a thermal ink jet printhead.

REFERENCES:
patent: 3672034 (1972-06-01), Clark
patent: 3700156 (1972-10-01), Hermanns
patent: 4499478 (1985-02-01), Matsufuji
patent: 4580148 (1986-04-01), Domoto
patent: 4610495 (1986-09-01), Landi
patent: 4612554 (1986-09-01), Poleshuk
patent: 4628150 (1986-12-01), Luc
patent: 4635073 (1987-01-01), Hanson
patent: 4675693 (1987-06-01), Yano
Bailx et al.; Sequential Bonding, Western Electric Technical Digest, No. 12, Oct. 1968, p. 1-2.

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