Thermal imprinting of substrates

Details Thermal imprinting of substrates Thermal imprinting of substrates

1980-10-06

1983-09-13

Hess, Bruce H.

Stock material or miscellaneous articles

Structurally defined web or sheet

Including components having same physical characteristic in...

156234, 156240, 427148, 428200, 428207, 428483, 428484, 428497, 428516, 428523, 428913, 428914, B41M 526

Patent

active

044042493

ABSTRACT:
Thermal imprinting of substrates, for example one or more surfaces of multi-dimensional objects, using a heat transfer film formed by a carrier and a release layer of pigmented, low molecular weight polyolefin. The imprint is made by bringing the transfer layer into contact with the surface of an object and applying heat. This releases the transfer layer to the surface being imprinted. When the transfer layer is required to have any significant thickness, it desirably includes a low melting point wax or resin to provide flexibility. The release characteristic can be improved by the inclusion of a further crystalline wax layer between the transfer layer and the carrier.

REFERENCES:
patent: 3519511 (1970-07-01), Coover
patent: 3567571 (1971-03-01), Martinovich
patent: 3852091 (1974-12-01), Newman
patent: 4294641 (1981-10-01), Reed et al.

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