Thermal imaging method

Radiation imagery chemistry: process – composition – or product th – Dye image from radiation sensitive dye or dye former by dry... – Composition or product

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

430343, 430945, 430955, 430964, 503218, 503221, 503222, 548207, G03C 172

Patent

active

047204494

ABSTRACT:
A thermal imaging method is provided which comprises heating imagewise a di- or triarylmethane compound possessing within its di- or triarylmethane structure an aryl group substituted in the ortho position to the meso carbon atom with a moiety ring-closed on the meso carbon atom directly through a nitrogen atom, which nitrogen atom is also bound to a group with a masked acyl substituent that undergoes fragmentation upon heating to liberate the acyl group for effecting intramolecular acylation of said nitrogen atom to form a new group in the ortho position whereby the di- or triarylmethane compound is rendered colored in an imagewise pattern corresponding to said imagewise heating.

REFERENCES:
patent: Re29168 (1977-04-01), Jenkins et al.
patent: 3488705 (1970-01-01), Fox et al.
patent: 3832212 (1974-08-01), Jenkins et al.
patent: 4097288 (1978-06-01), Lawton
patent: 4122089 (1978-10-01), Kimura et al.
patent: 4380629 (1983-04-01), Yamashita et al.
patent: 4500897 (1985-02-01), Matsuda et al.
Kosar, J., Light-Sensitive System: Chemistry and Application of Nonsilver Halide Photographic Processes, New York, NY John Wiley and Sons, Inc., 1976, pp. 402-419.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Thermal imaging method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermal imaging method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal imaging method will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-371555

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.