Thermal imaging cameras

Radiant energy – Invisible radiant energy responsive electric signalling – Semiconductor system

Reexamination Certificate

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Reexamination Certificate

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10470702

ABSTRACT:
A modular hyperspectral thermal camera that combines a wide field-of-view with a low erroneous recognition rate is described. The modular hyperspectral thermal camera provides such low erroneous recognition rates without any requirement for cryogenically cooling the associated optical components. The modular nature of the hyperspectral thermal camera permits easy exchange of the optical components and so provides a device that is easily calibrated and varied in resolution. In addition the modular nature allows the hyperspectral thermal camera to be readily converted to a broad band thermal camera, a full field spectrograph or a thermal bandpass filter camera, as required.

REFERENCES:
patent: 4806761 (1989-02-01), Carson et al.
patent: 4820923 (1989-04-01), Wellman
patent: 6008492 (1999-12-01), Slater et al.
patent: 6079665 (2000-06-01), Nella et al.
patent: 6104488 (2000-08-01), LeVan
patent: 6853452 (2005-02-01), Laufer
patent: 2003/0007254 (2003-01-01), Tocci
patent: 2004/0119020 (2004-06-01), Bodkin

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