Thermal head including Si substrate and method for...

Details Thermal head including Si substrate and method for... Thermal head including Si substrate and method for...

2007-07-24

2007-07-24

Tran, Huan (Department: 2861)

Incremental printing of symbolic information

Thermal marking apparatus or processes

Specific resistance recording element type

Reexamination Certificate

active

11048337

ABSTRACT:
A thermal head includes a heat storage layer disposed on a substrate surface by lamination, a plurality of heating elements disposed on the heat storage layer, a plurality of individual electrodes, each connected individually to one end-portion of a heating element in the length direction of the resistance, and a common electrode electrically connected to the other end-portions of all heating elements in the length direction of the resistance, wherein the above-described substrate is a Si substrate having a resistivity of 20 mΩ·cm or less, the Si substrate is provided with an exposure region including no heat storage layer, and a contact portion is disposed on the exposure region, so as to keep the common electrode and the Si substrate surface in ohmic contact.

REFERENCES:
patent: 4635075 (1987-01-01), Grummer et al.
patent: 4795887 (1989-01-01), Myokan
patent: 5148188 (1992-09-01), Ota et al.
patent: 5361086 (1994-11-01), Tagashira
patent: 5680170 (1997-10-01), Taniguchi et al.
patent: 6201558 (2001-03-01), Shirakawa et al.
patent: 6331868 (2001-12-01), Yamade et al.
patent: 6-61947 (1994-08-01), None
patent: 10-034991 (1998-02-01), None

Affiliated with

Also associated with

Rating

Thermal head including Si substrate and method for... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermal head including Si substrate and method for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal head including Si substrate and method for... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3768211