Thermal head including bonding pads having irregular...

Details Thermal head including bonding pads having irregular... Thermal head including bonding pads having irregular...

2006-01-25

2008-01-29

Feggins, K. (Department: 2861)

Incremental printing of symbolic information

Thermal marking apparatus or processes

Specific resistance recording element type

Reexamination Certificate

active

07324126

ABSTRACT:
A thermal head includes a large number of heating resistors disposed at a regular interval, individual conductors individually connected to each of the heating resistors, and common conductors connected to each of the heating resistors in common, the individual conductors and the common conductors serving as conductors for supplying the heating resistors with a current. In the thermal head, an underlayer having a large number of irregularities is provided and a conductor layer is provided on the underlayer along the irregularities. Thereby, bonding pads that are composed of the conductor layer and that have irregularities are provided as electrodes of the individual conductors or the common conductors.

REFERENCES:
patent: 6304280 (2001-10-01), Yamade et al.
patent: A1 5-251856 (1993-09-01), None

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