Thermal head having adhesive interposed between adhesion...

Incremental printing of symbolic information – Thermal marking apparatus or processes – Specific resistance recording element type

Reexamination Certificate

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Details

C347S205000

Reexamination Certificate

active

11092181

ABSTRACT:
A thermal head includes a head substrate having a plurality of heating resistors which generate heat by electrical dissipation, a common electrode connected to one end of each heating resistor, and a plurality of individual electrodes connected to the other ends of the respective heating resistors. The head substrate is disposed on a heat-dissipation plate. A wide-gap stepped portion is disposed in correspondence with at least a location of the head substrate directly below the heating resistors, and increases an interval between an adhesion surface of the head substrate and an adhesion surface of the heat-dissipation plate. A resilient adhesive capable of absorbing thermal strain is interposed between the adhesion surface of the heat-dissipation plate and the adhesion surface of the head substrate in an adhesion plane where the wide-gap stepped portion is disposed.

REFERENCES:
patent: 5285216 (1994-02-01), Ota et al.
patent: 5444475 (1995-08-01), Mitani
patent: 5568176 (1996-10-01), Moon et al.
patent: 60107361 (1985-06-01), None
patent: 1-190467 (1989-07-01), None
patent: 11-28829 (1999-02-01), None
patent: 1-131538 (1999-09-01), None
patent: 2001-315371 (2001-11-01), None
patent: 2004/322450 (2004-11-01), None
Search Report dated Oct. 26, 2006 for corresponding European Patent Application No. 05006022.7.

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