Thermal head for a printer

Recorders – Thermal recording

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

B41J 234

Patent

active

052238555

ABSTRACT:
The invention provide a thermal head wherein a head substrate composed by disposing plural heating resistance elements on a support board, and a flexible wiring substrate for connecting the heating resistance elements and an external circuit are adhered together by using a soft adhesive with the shear adhesion strength of 25 kg/cm.sup.2 or less.
According to the invention, without having to dispose a reinforcing plate for reinforcing the flexible wiring substrate, the flexible wiring substrate and the head substrate are adhered directly with soft adhesive, and therefore when printing, especially when printing continuously, if the temperature of the head substrate and flexible wiring substrate is raised, the difference in the thermal expansion of the two is absorbed sufficiently by the elasticity of the elastic wiring substrate, and the difference in the thermal expansion between the head substrate and flexible wiring substrate and support board is absorbed by the soft adhesive, and hence the deformation of the thermal head may be eliminated completely, and the transmission of electric signal from external circuit to the integrated circuit is made accurate, so that printing may be done in normal state.

REFERENCES:
patent: 4680593 (1987-07-01), Takeno et al.
patent: 5028935 (1991-07-01), Warmack et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Thermal head for a printer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermal head for a printer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal head for a printer will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1759020

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.