Thermal head and manufacturing method thereof

Recorders – Thermal recording

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Details

358307, 358308, 358309, 252514, 252518, 252521, B41J 2325

Patent

active

052509583

ABSTRACT:
In a thermal head comprising at least a pair of electrodes (3), (4), (13), (14), resistor layers (2), (12) in contact against both the electrodes (3), (4), (13), (14), basic plates (1), (11) for supporting the electrodes (3), (4), (13), (14) and the resistor layers (2), (12), the resistor layers (2), (12) are composed of the matrix of the glass and the metal and/or oxide of the resistor component element penetrated into the gap of the atomic coupling of the matrix. The resistor layers (2), (12) are made of paste containing the organic compound of the resistor component element, and the organic compound of the glass matrix component element or glass frit. The thermal head is homogeneous in the resistor layer thereof, and gives the recordings of superior quality.

REFERENCES:
patent: 3271193 (1966-09-01), Boykin
patent: 3607789 (1971-09-01), Murthy et al.
patent: 3639274 (1972-01-01), Brandt et al.
patent: 3868334 (1975-02-01), Van Loan
patent: 3899449 (1975-08-01), Pukaite
patent: 4130671 (1978-12-01), Nagesh et al.
patent: 4203025 (1980-05-01), Hitachi
patent: 4293838 (1981-10-01), Wahlers et al.
patent: 4695504 (1987-09-01), Watanabe et al.
patent: 5021194 (1991-06-01), Watanabe et al.

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