Typewriting machines – Typing by other than type-face or type-die – Thermal
Patent
1996-07-11
1997-12-30
Yan, Ren
Typewriting machines
Typing by other than type-face or type-die
Thermal
347180, B41J 2355
Patent
active
057021880
ABSTRACT:
A thermal head includes a thermal resistance member formed in a straight form, a first lead conductor group having a plurality of first lead conductors which are connected to the thermal resistance member, a second lead conductor group having a plurality of second lead conductors which are connected to the thermal resistance member, the first lead conductors and the second lead conductors being alternately arranged at a given interval, a third lead conductor group connected to the thermal resistance member between the first and second lead conductor groups, and a switch having a first selecting mode for selecting the first lead conductor group and a second selecting mode for selecting the second lead conductor group, wherein when the switch selects the first selecting mode, a region of the thermal resistance member sandwiched by the first lead conductor group and the third lead conductor group is heated, and when the switch selects the second selecting mode, a region of the thermal resistance member sandwiched by the second lead conductor group and the third lead conductor group is heated; and wherein the switch includes a potential applying unit for applying a preselected potential other than 0 to the second lead conductor group during the first selecting mode, and for applying a predetermined potential other than 0 to the first lead conductor group during the second selecting mode.
REFERENCES:
patent: 4360818 (1982-11-01), Moriguchi
patent: 4404567 (1983-09-01), Katsuragi
patent: 4575732 (1986-03-01), Kitaoka
patent: 5066960 (1991-11-01), Deguchi
patent: 5134425 (1992-07-01), Yeung
patent: 5235346 (1993-08-01), Yeung
patent: 5482386 (1996-01-01), Thiel et al.
Morita Minoru
Noguchi Masatoshi
Toyosawa Takeshi
Watanabe Toshiya
Graphtec Corporation
Kelley Steven S.
Yan Ren
LandOfFree
Thermal head and head drive circuit therefor does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thermal head and head drive circuit therefor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal head and head drive circuit therefor will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-196436