Thermal head and bonding connection method therefor

Details Thermal head and bonding connection method therefor Thermal head and bonding connection method therefor

2006-11-28

2006-11-28

Feggins, K. (Department: 2861)

Incremental printing of symbolic information

Thermal marking apparatus or processes

Specific resistance recording element type

Reexamination Certificate

active

07142228

ABSTRACT:
A thermal head includes a head substrate having a common electrode and individual electrodes connected to exothermic bodies and a driving IC substrate having driving ICs controlling electrification of the individual electrodes and IC electrode pads arranged substantially in parallel with and at a smaller pitch (at most 60 μm) than the exothermic bodies. The individual electrodes and the corresponding IC electrode pads are bonded together with connection wire having a diameter of at most 23 μm. The connection wire includes a connection portion with a width larger than the wire diameter that is connected to the individual electrodes or the IC electrode pads and an upstanding portion raised from the connection portion at a predetermined angle. The surface area of the connection portion is not less than 0.0015 mm2and the sectional area of the upstanding portion is not less than 0.00025 mm2.

REFERENCES:
patent: 5781220 (1998-07-01), Nishizono et al.
patent: 6326990 (2001-12-01), Imai
patent: 08-090811 (1996-04-01), None

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