Thermal head

Recorders – Thermal recording

Patent

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Details

H04N 1032, B41J 2345, B41J 2335

Patent

active

050599860

ABSTRACT:
A thermal head including a substrate, a thermal element array including a plurality of thermal elements linearly disposed on the substrate, a plurality of driver ICs provided on the substrate and including a plurality of drive circuit elements for controlling the thermal elements through electric conduction in accordance with a print signal, two common electrode patterns provided on the substrate, a first wiring pattern provided on the substrate for connecting each one end of each adjacent pair of the thermal elements commonly to one of the drive circuit elements, second and third wiring patterns provided on the substrate for connecting the other ends of the thermal elements separately to two common electrodes, the plurality of driver ICs being disposed along the thermal element array, the two common electrodes being arranged on opposite sides of the thermal element array and output terminals of the driver ICs, one of the adjacent thermal elements being formed of a single thermal resistor while the other is formed of two thermal resistors.

REFERENCES:
patent: 4492482 (1985-01-01), Eguchi et al.

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