Thermal head

Details Thermal head Thermal head

1991-10-16

1994-01-18

Fuller, Benjamin R.

Recorders

Thermal recording

B41J 2345

Patent

active

052803015

ABSTRACT:
By dividing plural heating elements of a thermal head into plural blocks, when heating and driving by connecting drive circuit elements to the blocks, print data and control signals are fed to the drive circuit elements either parallel or in series to the drive circuit elements. In this case it is sometimes difficult to form fine circuit wirings on the insulating substrate, or buffers are needed for amplifying the signals when sequentially transferring print data among drive circuit elements. Therefore, a flexible wiring substrate is disposed near the drive circuit elements on the insulating substrate, and plural signal lines over the arranging range of the drive circuit elements, and connection lines for supplying signals to the drive circuit elements from the signal lines are formed on the wiring substrate. On the insulating substrate, connection lines of flexible wiring substrate and connection lines for connecting with the drive circuit elements are formed.

REFERENCES:
patent: 4795887 (1989-01-01), Myokan
patent: 4954839 (1990-09-01), Rogers et al.
patent: 4963886 (1990-10-01), Fukuda et al.
patent: 4972205 (1990-11-01), Nagato

Affiliated with

Also associated with

Rating

Thermal head does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermal head, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal head will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1139152