Thermal head

Details Thermal head Thermal head

1989-10-26

1991-01-15

Reynolds, Bruce A.

Recorders

Thermal recording

G01D 1510

Patent

active

049857126

ABSTRACT:
A thermal head of this invention has an improved protective layer on the head surface. The protective layer comprises a compound containing Si, O, N, and a metal M (wherein M is at least one metal selected from the group consisting of Zr, Mg, and Y). The protective layer has high hardness and toughness and does not deform much nor crack if a local concentrated load acts on it during operation of the thermal head. In the thermal head of this invention, the protective layer and a high-resistance substrate comprises a material having high hardness such as a metal, an alloy, or a ceramic protect various interlayers formed therebetween. Even if a layer comprising a material having low hardness such as a heat insulating layer comprising a heat-resistant resin is included as an interlayer, deformation or a crack caused by a local stress acting on the thermal head can be prevented. The protective layer can be produced at a higher sputtering rate than that of a conventional SIALON film or the like and therefore is superior in a mass-production property.

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