Thermal head

Details Thermal head Thermal head

1986-01-23

1988-08-16

Goldberg, E. A.

Electric heating

Heating devices

Combined with diverse-type art device

346 76PH, 400120, 219541, 219542, H05B 100

Patent

active

047646594

ABSTRACT:
In an IC-loaded thermal head, a flip chip is used as IC, and respective terminals of IC elements are directly connected by wireless bonding to terminals of heat generators of the head and terminals for external connection.

REFERENCES:
patent: 4595823 (1986-06-01), Sorimachi et al.
patent: 4651164 (1987-03-01), Abe et al.
IBM Technical Disclosure Bulletin vol. 24, No. 2, 07/1981.

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