Thermal head

Details Thermal head Thermal head

1997-10-06

2000-02-22

Tran, Huan

Incremental printing of symbolic information

Thermal marking apparatus or processes

Specific resistance recording element type

347210, B41J 2335, B41J 234

Patent

active

060286199

ABSTRACT:
A thermal head comprises a substrate having a main surface bounded by a peripheral edge, an electrode formed on the surface of the substrate, and a heater disposed on the surface of the substrate and electrically connected to the electrode. A driver IC is disposed on the surface of the substrate and is electrically connected to the electrode for providing a drive signal to drive the heater. An encapsulation element is disposed over the IC for protecting the IC. The encapsulation element has a surface portion which extends to the peripheral edge of the substrate.

REFERENCES:
patent: 4689638 (1987-08-01), Matsuzaki et al.

Affiliated with

Also associated with

Rating

Thermal head does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermal head, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal head will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-524411