Thermal gap control

Details Thermal gap control Thermal gap control

2005-09-06

2005-09-06

Zarabian, Amir (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Incorporating resilient component

C438S122000, C257S706000, C361S709000, C361S801000

Reexamination Certificate

active

06939742

ABSTRACT:
A heat dissipating element (e.g., a heat sink) is held in an initial position closer to a heat generating structure (e.g., a microprocessor) and in a subsequent position farther from the microprocessor. A thermal interface material (e.g., a thermal grease) spans the gap, but is not held under compression, between the heat sink and the microprocessor.

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