Measuring and testing – Volume or rate of flow – Thermal type
Reexamination Certificate
2006-05-02
2006-05-02
Patel, Harshad (Department: 2855)
Measuring and testing
Volume or rate of flow
Thermal type
Reexamination Certificate
active
07036369
ABSTRACT:
A thermal flow sensor has a first, second and third substrate, each having a first side and a second opposite side. The first substrate is connected to the second substrate such that the second side of the first substrate abuts the first side of the second substrate. The third substrate is connected to the second substrate such that the second side of the second substrate abuts the first side of the third substrate. The second substrate has a groove formed therein so as to form a conduit bounded by the second substrate and the second side of the first substrate and the first side of the third substrate. A heater is disposed on the first side of the first substrate opposed to the conduit. A first temperature sensor is disposed on the first side of the first substrate opposed to the conduit. A second temperature sensor is disposed on the first side of the first substrate opposed to the conduit. A first recess is formed in at least one of the first side and the second side of the first substrate between the heater and one of the first temperature sensor and the second temperature sensor.
REFERENCES:
patent: 4343768 (1982-08-01), Kimura
patent: 4542650 (1985-09-01), Renken et al.
patent: 4555940 (1985-12-01), Renger
patent: 5553497 (1996-09-01), Doi et al.
Burger Juergen
Buser Rudolf
Keppner Herbert
Zumkehr Frank
Codman & Shurtleff Inc.
Mack Corey D.
Patel Harshad
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