Thermal flow sensor having an inverted substrate

Details Thermal flow sensor having an inverted substrate Thermal flow sensor having an inverted substrate

2006-07-04

2006-07-04

Patel, Harshad (Department: 2855)

Measuring and testing

Volume or rate of flow

Thermal type

Reexamination Certificate

active

07069779

ABSTRACT:
A thermal flow sensor has a first substrate, second substrate and a third substrate, each of which has a first side and a second opposite side. The first substrate is connected to the second substrate such that the second side of the first substrate abuts the first side of the second substrate. The third substrate is connected to the second substrate such that the second side of the second substrate abuts the first side of the third substrate. The second substrate has a groove formed therein so as to form a conduit bounded by the second substrate and the second side of the first substrate and the first side of the third substrate. A heater is disposed on the first side of the first substrate opposed to the conduit. A first temperature sensor is disposed on the first side of the first substrate opposed to the conduit.

REFERENCES:
patent: 6647778 (2003-11-01), Sparks
patent: 6684693 (2004-02-01), Tanimoto et al.

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