Thermal fatigue resistant low-melting point solder alloys

Details Thermal fatigue resistant low-melting point solder alloys Thermal fatigue resistant low-melting point solder alloys

1983-06-07

1985-01-01

Rutledge, L. Dewayne

Alloys or metallic compositions

Containing over 50 per cent metal but no base metal

Tin containing

219 85H, 22826311, 420580, C22C 3004

Patent

active

044915624

ABSTRACT:
This invention provides a thermal fatigue resistant, low-melting point solder alloy consisting of 13 to 20% by weight Bi, 42 to 50% by weight, Pb, the balance being Sn. This solder alloy is suited for lap joints of electronic parts into or onto a printed substrate or a hybrid substrate.

REFERENCES:
"Bismuth Solders," The Metal Industry Magazine, Mar. 5, 1943 issue, pp. 150-151.

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