Thermal expansion relieving support for printhead assembly

Details Thermal expansion relieving support for printhead assembly Thermal expansion relieving support for printhead assembly

2007-03-06

2007-03-06

Meier, Stephen (Department: 2861)

Incremental printing of symbolic information

Ink jet

Ejector mechanism

C347S020000

Reexamination Certificate

active

10728797

ABSTRACT:
A support member (3) forming part of a printhead assembly (1) for an inkjet printer with a plurality of printhead modules (2). The support member (3) has a first component (6) and a second component (5). The first component (6) mounts the printhead assembly (1) within an inkjet printer, and the second component (5) mounts the printhead modules (2). The second component (5) has a coefficient of thermal expansion closer to that of the printhead modules (2) than the first component (6) and the first component is bonded to the second component via intermediate resilient material (7). This allows the first component (6) to be a high strength low cost material such as steel, and the second component (5) can be selected so that the overall coefficient of thermal expansion of the support member is closer to that of the printhead modules. This reduces the difference between the thermal expansion of the printhead modules (2) and the support member (3). This, in turn, makes the printing alignment of individual modules (2) with their adjacent modules is easier. By including and intermediate layer of elastomeric material (7), the greater expansion of the metal component has less effect on the other component, and therefore less effect on the alignment of the printhead modules mounted to this component.

REFERENCES:
patent: 5528272 (1996-06-01), Quinn et al.
patent: 5734394 (1998-03-01), Hackleman
patent: 6325488 (2001-12-01), Beerling et al.
patent: 6652071 (2003-11-01), Silverbrook
patent: 6802594 (2004-10-01), Silverbrook
patent: 11-010861 (1999-01-01), None
patent: 2000-280496 (2000-10-01), None
patent: WO 99/65691 (1999-12-01), None

Affiliated with

Also associated with

Rating

Thermal expansion relieving support for printhead assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermal expansion relieving support for printhead assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal expansion relieving support for printhead assembly will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3771888