Thermal expansion mismatch forgivable printed wiring board for c

Details Thermal expansion mismatch forgivable printed wiring board for c Thermal expansion mismatch forgivable printed wiring board for c

1988-03-21

1989-07-11

Robinson, Ellis P.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428332, 428339, 428413, 428414, 428416, 4284735, 428901, 174 685, 361398, 156277, 156289, 156291, 156310, B32B 900

Patent

active

048471364

ABSTRACT:
A modified printed wiring board for reducing the cracking of solder joints used to attach ceramic leadless chip carriers to the surface of the printed wiring board. A relatively thin expansion layer is provided on top of the conventional printed wiring board. This expansion layer is bonded to the printed wiring board except at locations underneath the footprint of the chip carrier and solder joints. This expansion layer reduces the stress of solder joints between the ceramic leadless chip carrier and the printed wiring board due to thermal expansion mismatch, thereby reducing cracking of the solder joint.

REFERENCES:
patent: 4458294 (1984-07-01), Womack
patent: 4647508 (1987-03-01), Gazit et al.
patent: 4658332 (1987-04-01), Baker et al.
patent: 4680220 (1987-07-01), Johnson

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