Thermal expansion connection for rigid pipes

Pipe joints or couplings – Deformed

Reexamination Certificate

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Details

C285S351000, C285S347000, C285S187000, C029S508000, C029S516000

Reexamination Certificate

active

06848725

ABSTRACT:
A thermal expansion connection for rigid pipes in low-pressure applications subject to thermal expansion and shrinkage. The connection is formed between the distal end of a first rigid pipe received within the proximal end of a second rigid pipe. At least one seal is disposed between the first and second rigid pipes to prevent fluid communication through the connection. The second rigid pipe defines a collar at the proximal end thereof for receiving the distal end of the first rigid pipe and the seals. The first rigid pipe distal end defines a radial recess for receiving and maintaining the position of each seal. A gap is defined between the first rigid pipe distal end and the second rigid pipe collar to allow for thermal expansion and contraction of the first and second rigid pipes.

REFERENCES:
patent: 3211476 (1965-10-01), Wagner
patent: 3584902 (1971-06-01), Vyse
patent: 4055359 (1977-10-01), McWethy
patent: 4330924 (1982-05-01), Kushner et al.
patent: 4715624 (1987-12-01), Frye
patent: 4807913 (1989-02-01), Bartholomew
patent: 4850621 (1989-07-01), Umehara
patent: 4993756 (1991-02-01), Bechu
patent: 5094494 (1992-03-01), McConnell
patent: 5190323 (1993-03-01), Oetiker
patent: 5207460 (1993-05-01), Oetiker
patent: 5295718 (1994-03-01), Bartholomew
patent: 5380050 (1995-01-01), Sanders et al.
patent: 5749138 (1998-05-01), Usui et al.
patent: 5775740 (1998-07-01), Fukaya et al.
patent: 5794982 (1998-08-01), Green et al.
patent: 5816626 (1998-10-01), Anderson et al.
patent: 5890287 (1999-04-01), Fukaya
patent: 5918914 (1999-07-01), Morris
patent: 5975587 (1999-11-01), Wood et al.
patent: 6053537 (2000-04-01), Guest
patent: 6099045 (2000-08-01), Pirona
patent: 6286556 (2001-09-01), Kato
patent: 6286877 (2001-09-01), Mendoza et al.

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