Thermal expansion compensation for printhead assembly

Incremental printing of symbolic information – Ink jet – Ejector mechanism

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

07090335

ABSTRACT:
A printhead assembly (1) for an inkjet printer, the printhead assembly (1) having a support member (3) for mounting the printhead assembly (1) within an inkjet printer, and, a plurality of printhead modules (2) mounted to the support member (3). The support member (3) has an overall coefficient of thermal expansion such that it changes its dimensions between its production temperature, when the printhead is assembled, and an operation temperature reached during normal operation of the printer. The printhead modules (2) are mounted to the support member (3) at the production temperature such that they align when the printhead assembly (1) is at the operating temperature.

REFERENCES:
patent: 5528272 (1996-06-01), Quinn et al.
patent: 5734394 (1998-03-01), Hackleman
patent: 6802594 (2004-10-01), Silverbrook
patent: 2005/0041064 (2005-02-01), Silverbrook
patent: 11-010861 (1999-01-01), None
patent: 2000-280496 (2000-10-01), None
patent: WO 99/65691 (1999-12-01), None
Derwent Abstract Acc No. 20000-676139/66, T04,JP 2000280496 (Tokyo Elec Co Ltd) Oct. 10, 2000.
Derwent Abstract Acc No. 99-147317/13, JP 11-010861A (Brother Kogyo KK) Jan. 19, 1999.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Thermal expansion compensation for printhead assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermal expansion compensation for printhead assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal expansion compensation for printhead assembly will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3659317

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.