Thermal enhancing test/burn in socket for C4 and tab packaging

Details Thermal enhancing test/burn in socket for C4 and tab packaging Thermal enhancing test/burn in socket for C4 and tab packaging

1996-03-29

1999-07-13

Karlsen, Ernest F.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324758, 324760, G01R 3102

Patent

active

059231793

ABSTRACT:
A test socket used to test an integrated circuit that is mounted to a package or circuit board. The test socket includes a base that supports the integrated circuit and the circuit board. Pivotally connected to the socket's base are a pair of heat sinks that can be moved between a first position and a second position. When in the first position the heat sinks are pressed into either the package or integrated circuit to provide a direct conductive path between the integrated circuit die and the heat sinks. A plurality of test contacts are placed into contact with a plurality of surface pads located on the package to test the integrated circuit. The direct conductive path between the heat sinks and the die lowers the overall thermal impedance of the socket assembly and the junction temperatures of the integrated circuit during an electrical test routine of the circuit.

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patent: 5247250 (1993-09-01), Rios
patent: 5402077 (1995-03-01), Agahdel et al.

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