Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2007-06-25
2009-06-09
Le, Dung A. (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S718000, C257S758000, C438S620000, C438S622000
Reexamination Certificate
active
07545034
ABSTRACT:
An electrical structure including a first substrate comprising a plurality of electrical components, a first thermally conductive film layer formed over and in contact with a first electrical component of the plurality of electrical components, a first thermally conductive structure in mechanical contact with a first portion of the first thermally conductive film layer, and a first thermal energy extraction structure formed over the first thermally conductive structure. The first thermal energy extraction structure is in thermal contact with the first thermally conductive structure. The first thermal energy extraction structure is configured to extract a first portion of thermal energy from the first electrical component through the first thermally conductive film layer and the first thermally conductive structure.
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patent: 2006/0278901 (2006-12-01), Dangelo et al.
Kim Deok-kee
Li Wai-Kin
Yang Haining Sam
International Business Machiens Corporation
Le Dung A.
Schmeiser Olsen & Watts
Yaghmour Rose
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