Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Automatic and/or material-triggered control
Patent
1997-04-07
1998-09-22
Sells, James
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
Automatic and/or material-triggered control
156555, 1565831, 100171, B32B 3100
Patent
active
058109650
ABSTRACT:
A thermal embossing/laminating system of printing machine (especially for the label printing machine, letter press, flexible printing machine) including a left support, a right support, an upper roller, a lower roller with heating device, an infrared preheating device, a temperature measuring device, a drive device and a temperature controlling device. The characteristic of the system is that at least one shaft of upper roller or lower roller is disposed with a heating device, and the infrared preheating device is disposed beside the supports. A power switch, the temperature controlling device and temperature measuring device automatically detect and adjust the heating device, so that the heating (preheating) device can conduct and distribute heat to the roller and laminating film evenly. The roller and the laminating film can reach and stand at a set constant temperature. So the laminating with hot melt adhesive rolled by the rollers to be easily and planely laminated on the surface of the printed article.
REFERENCES:
patent: 5061337 (1991-10-01), Fraser
patent: 5223071 (1993-06-01), Gersbeck
patent: 5540806 (1996-07-01), Traise
patent: 5639339 (1997-06-01), Couillard
LandOfFree
Thermal embossing/laminating system of printing machine does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thermal embossing/laminating system of printing machine, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal embossing/laminating system of printing machine will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1619469