Thermal docking station for electronics

Details Thermal docking station for electronics Thermal docking station for electronics

2008-07-22

2008-07-22

Datskovskiy, Michael V (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S689000, C361S689000, C361S699000, C361S727000, C165S104210, C165S104330, C062S003200, C062S003300

Reexamination Certificate

active

07403384

ABSTRACT:
For transferring heat generated by an electronic device, a component heat exchanger is thermally coupled to the electronic device. A component-side thermal interface is thermally coupled to the component heat exchanger by a heat conductor. A rack-side thermal interface is thermally coupled to the component-side thermal interface to transfer the heat from the component-side thermal interface to a heat exchanger. A thermoelectric cooler (TEC) is thermally coupled in series with at least one of the component-side thermal interface and rack-side thermal interface. The TEC is operable to increase an amount of the heat transferred from the electronic device to the heat exchanger in response receiving an electrical input.

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